1 Part Epoxy Potting Adhesive

NO. EPO1000
Type 1 Part
Package Others
Color White/ Clear or others
Model Others
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NO.
EPO1000
Type
1 Part
Package
Others
Color
White/ Clear or others
Model
Others
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Chaep 8866 epoxy adhesive cured by heat, designed for general structure adhesive applications


one component epoxy adhesive cured by heat, designed for general structure adhesive applications.

The cured material can provide excellent shear strength, along with impact and heat resistance. It’s designed for protection of bare semiconductor devices.

  1. One component ,solvent free

  2. Easy to handling

  3. Low stress

  4. No Halogen

  5. low VOC, low odor

  6. High shear and impact strength

  7. High temperature resistance

  8. Excellent outing aging

  9. Excellent electrical insulation

  10. Good moisture resistance

  11. Exhibits relatively high flow

Color: Black, White

Packging: 30cc/pcs

Application:

  1. BGA

  2. IC memory cards

  3. Chip carriers

  4. Hybrid circuits

  5. Chip-on-board

  6. Multi-chip modules and Pin grid arrays

  7. Automotive applications

Way of Use:

Surface preparation:keep surfaces clean, dry and grease-free, use a suitable solvent(such as alcohol, acetone) for the degreasing.

Apply the adhesive to cleaned surfaces, assemble parts by sufficient pressure to spread the adhesive to all bonding area. Use a jig/clamp to fix parts till the adhesive is fully cured.

Cure the adhesive according to the schedule listed in the table. Do not move/shock parts during curing.

Before using up, keep the adhesive container tightly sealed.

Items

Value

Method

Before cured

Appearance

Transpanent fluid

\

Viscosity,25℃,mPa.s

1100±300

GB/10247-2008

Specific gravity,25℃,g/cm3

1.10±0.05

GB/T 13354-92

Shelf life

3 mon@ -5℃

Curing conditions

30min@150℃

\

Hardness,Shore D

83±5

GB/T 531.1-2008

Coefficient of Thermal Conductivity, W/(m·K)

0.27

GB/T 20673-2006

Shear strength, Mpa, steel/steel

>12

GB 6328-86

Glass Transition Temperature (Tg) by TMA, °C

120

GB 11998-1989

Service temperature(℃)

-40~180

GBT 20028-2005




Chaep 51-8866 black solvent-free single-component epoxy structural adhesive


A black, solvent-free, single-component epoxy structural adhesive with low viscosity, high adhesion strength, low linear expansion coefficient, good toughness and resistance to high and low temperature impact, and can be cured quickly at medium and low temperature. This product’s storage period is 6 months (-5℃t o 0 ℃ freezer)

Color: Black

Packging: 30cc/pcs,100ml, 1L

Application: Miniaturization, Lightweight, High output of power, Electrical and electronic equipment

Way of Use:

If the epoxy adhesive is stored in a frozen environment, it should be removed and defrosted at room temperature before use. During use, the glue should be avoided in a high temperature environment to reduce the consistency of the glue, unless it has been tested in this area and confirmed to be feasible.

Apply the adhesive directly to the surface of the object to be bonded after oil removal, rust removal and coarsening treatment. Select appropriate tools to assist the adhesive coating and fix it with fixtures. Then solidify according to the recommended heating conditions.


ITEMTest method or condition

Chaep 51-8866

Before curing

AppearanceVisual

Black paste

Viscosity

mPa·s, 25℃

21,000

Density

g/cm3, 25℃

1.51

After curing

HardnessShore-D, 25℃

88

Long-term temperature resistance range

–50-150

Thermal conductivity

W/m.k, 25℃

0.45

Volume resistivity

Ω· cm, DC500V

5.8×1014



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Chaep 8166 low temperature cured epoxy adhesive with high adhesion and low water absorption


A low temperature cured one-component epoxy adhesive with high adhesion and low water absorption.

It can be used for bonding of various materials and has good storage stability.

Color: Black

Packing:30ml/pcs

Storage conditionsP:

Store in a clean, dry place at -20°C.

Shelf life:6 month



Application: Mainly used for bonding LED backlight module lens, and bonding camera module CCD / CMOS frame, suitable for bonding temperature-sensitive components.

Way of Use:

Before use, it must be warmed at room temperature for more than 4 hours. Do not open the package until it is restored to room temperature.

It is recommended that the dispensing pressure be 0.15-0.25 MPa. Use needles 21 or 22 with a dispensing speed of 4-10 mm/s.

Applicable for 7 days at 25°C.

The unused glue is first put into a plastic bag and then stored in -20°C.

Item

Test standard8116 A

8116 B

Properties before cured:

Appearance


white or black paste

white or black paste

Base composition


epoxy resin

epoxy resin

Viscosity(mPa.s)

(GB/T 2794-1995)15000

13000-17000


(GB/T 13354-1992)

1.50

1.45-1.55

Properties after cured(sample cured at 80 ℃ 60 minutes)

Hardness(shore D) 80

(GB/T 2411-1980)

80

Shear strength(MPa)

(GB/T 7124-1986

(TSS-Fe)15,   (TSS-Al ) 10

Elongation at break(%)

(GB 1040-1992)

2.3

Glass transition temperature(℃)

(ASTM E1545)

45

Thermal expansion coefficient

(GB/T 1036-1989)

α1 (PPM/℃) 45, α2 (PPM/℃)130

Water absorption(%)(24h@25℃)

(GB/T 1034-1998)

0.15

Dielectric strength(KV/mm)

(GB 1408.1-1999)

≥20

Surface resistance(Ω)

(GB/T 1410-2006)

1×1015



Chaep 3666 low-viscosity one component high-performance epoxy resin structural adhesive

A low-viscosity, one-component, high-performance epoxy resin structural adhesive developed for miniaturization, lightweight and high output of power, electrical and electronic equipment.

It is characterized by good storage stability at room temperature, rapid curing under heating, high bonding strength, good toughness, and excellent temperature and weather resistance.

Color: Black

Packging: 1L/barrel

Application: Miniaturization, Lightweight, High output of power, Electrical and electronic equipment

Way of Use:

Products should be stored in a cool and cool place at low temperature

Remove the glue from the freezer before each use to restore the glue to normal temperature. The unused glue must be stored in the freezer

If the viscosity is suitable after the storage period, it can continue to be used

This product is non-dangerous and can be transported under normal conditions

Please consult our Marketing Department if you need glue coating equipment


ItemTest method or conditionTest Results
CHAEP 3666
Before curingAppearanceVisualWhite paste
ViscositymPa·s, 25℃12,000±2,000
densityg/cm3, 25℃1.45±0.05
Shelf life0~5℃6 month
20~25℃3month
After   curingHardnessShore-D, 25℃85
Glass transition temperature TgDSC, ℃115
Use temperature range–50-155
Shear strengthMPa, Steel-steel,25℃>20



Chaep 926 solvent-free, one-component epoxy structural adhesive

A gray, solvent-free, one-component epoxy structural adhesive with excellent toughness and impact strength.

When it is fully cured by heat, it provides excellent bonding properties, electrical properties, moisture resistance and mechanical properties. It has high bonding strength to most substrates including glass, metal, ceramics, etc., while meeting high temperatures. Bonding and mechanical properties.


Color: Gray

Packging: 30ml/pcs, 1L/barrel

Application: Widely used in automotive electronics, pressure sensors, connecting harnesses, motor magnetic sheet bonding.

Way of Use:

If the epoxy glue is stored in a frozen environment, it must be taken out to room temperature before being thawed before use.During sizing, do not reduce the consistency of the glue by exposing it to high temperatures, unless prior tests have been done and shown to be feasible.

Apply the adhesive directly to the surface of the object to be bonded after oil removal, rust removal and coarsening treatment. Select appropriate tools to assist the adhesive coating and fix it with fixtures. It is then cured under the recommended heating conditions.

ITEM

Test method or condition

629

Before curing

AppearanceVisual

Gray slurry

Viscosity

93C #Rotor, 5rpm,Pa·s, 25℃

112

Viscosity

93C #Rotor, 0.5rpm,Pa·s, 25℃

278

Thixotropic index

2.5

Density

g/cm3, 25℃

1.25-1.35

After curing

HardnessShore-D, 25℃

85

Glass transition temperature Tg

DSC, ℃

145

Impact strength

KJ/m2,25℃

>6

Linear expansion coefficient

ppm

45,<Tg

100,   >Tg

Volume resistivity

Ω· cm, DC500V

1.0×1015

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