Two Part Silicone Potting Sealant

Begel 8078 Two components soft transparent silicone gel

Two component silicone elastomer that crosslinks at room temperature by polyaddition reaction.The pueolymerisation can be accelerated by heat ( max. 150℃ ).

1. Fast mixing ( 1:1) and easy processing due to the low viscosity.

2. Room curing at normal.

3. Very fast curing kinetics at elevated temperature.

4. Adhereand elastic surface

5. High tensile strength

Color: Clear

Packaging: Part A:10 KG, Part B:10 KG,

Application: The cured gel is used in some medical mattress, headrest, skin sticker, electric parts, IGBT module, junction box, auto control, and inverter.

USE:

Mixing the two components

Chagel 8078 A & B are mixed by weight in a fixed ratio given above.

The two components may be thoroughly mixed either by hand or using a low-speed electric or pneumatic mixer to minimise the introduction of air and to avoid any temperature increase.

Further information is available upon request.

Handling

The mixture should be degassed preferably at 30 to 50 mbar to eliminate any entrapped air. If a dispensing machine is used, the two components are degassed separately prior to mixing.

The silicone mixture expands to 3 to 4 times of its initial volume and bubbles rise to the surface .The bubbles progressively disappear and the mixture returns to its initial volume after 2 to 3 minutes. Wait a few minutes to complete the degassing and then flash the vacuum. The silicone is ready for pouring, either by gravity or under low pressure.

Chasil 1-0328 A/B 1:1 Soft Low Stress thermal conductivity Silicone Gel

Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.

1. Soft, low durometer

2. Low viscosity

3. Room temperature or accelerated   heat cure

4. Good thermal conductivity

5. Mix ratio 1 to 1

6. Low internal stress during thermal cycling

7. Highly flowable for filling small gaps and fast processing

8. Good heat dissipation

9. Prevents water ingress

10. Electrically insulative

11. Low total cost of ownership

Color: Black

Packaging: Part A:10 KG, Part B:10 KG,

Application:

Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments such as:

1. Power Conversion Devices (Inverters, Converters, Driver)
   

2. Junction Boxes

3. Automotive Electronics Modules

DESCRIPTION

Silicone encapsulants are supplied as two- part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications.

Silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement.

Silicone encapsulants require no post cure and can be placed in service immediately following the completion of the cure schedule.

Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.

MIXING AND DE- AIRING

These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

Chagel 7078 A/B 1:1 Clear Two components soft silicone gel elastomer

A two component silicone elastomer that crosslinks at room temperature by polyaddition reaction. The pueolymerisation can be accelerated by heat.

1. Fast room temperature cure

2. Elastomer-like toughness

3. Protection from moisture, dirt, and other atmosphericcontaminants

4. Protection from mechanical stress and strain caused bythermomechanical shock and vibration

5. Easy repairability

6. Good dielectric properties, even at high frequencies

7. No solvents or cure by-products

8. Physical and electrical stability over a wide temperaturerange from -40° to 200°C

Color: Clear

Packaging: Part A:10 KG, Part B:10 KG,

Application: Used for semiconductor devices

Use:

Mixing the two components

A & B are mixed by weight in a fixed ratio given. The two components may be thoroughly mixed either by hand or using a low-speed electric or pneumatic mixer to minimise the introduction of air and to avoid any temperature increase.

Note: It is also possible to use a special mixing and dispensing machine for the two silicone components. Further information is available upon request.

Handling

The mixture should be degassed preferably at 30 to 50 mbar to eliminate any entrapped air. If a dispensing machine is used, the two components are degassed separately prior to mixing.

The silicone mixture expands to 3 to 4 times of its initial volume and bubbles rise to the surface .The bubbles progressively disappear and the mixture returns to its initial volume after 2 to 3 minutes. Wait a few minutes to complete the degassing and then flash the vacuum. The silicone is ready for pouring, either by gravity or under low pressure.

Note: Flashing the vacuum once or twice accelerates the degassing. It is recommended to use a container with a high diameter/height ratio(3 to 4 times of the initial volume)

Polymerisation

The system, as indicated in the technical data, polymerises at 25℃ .The curing may be slowed down at lower temperature and contrary accelerated by applying heatNote: in general contact with certain materials can inhibit the crosslinking of RTV.

See list below:

Natural rubbers vulcanised with sulphur

RTV elastomers catalysed with metal salts,e.g. tin compounds

PVC stabilised with tin salts and additives

Epoxy catalysed with amines

Certain organic solvents, e.g.Ketones, alcohols, ether   etc.

Chasil 5218 A/B 10:1 condensation de-alcohol type low viscosity silicone potting material

A normally popular potting material. It supplies stable protection to variety of electric components. The mixture is flowable, would be deeply cured. The operation time can be adjusted according to the temperature and agent added. The majority of materials have a good bonding effect without primer, suitable for accessories fixed and waterproof, dust and leakage.

1. Two-component, condensation de-alcohol type

2. Low viscosity, easy processing

3. Low hardening shrinkage, no corrosion without stress

4. Excellent high temperature electrical insulation, stability set

5. Excellent adhesion, good waterproof, moisture resistance

Color: Clear, White

Application: Automotive electronics, modules, Power control module, Solar module junction box, LED spotlights, wall washer, bar lights, LED lamps

Use:

A, B components according to the ratio of 100: 10 weighing, mixing evenly, directly into the pot to protect the components (or modules). It is best to slowly follow the side of the wall, can reduce the generation of bubbles.

the potting of the components put away, let its own bubble, conditional customers can be in the potting before the vacuum mixture of vacuum degassing treatment. Directly at room temperature curing, usually within 1-6hr to achieve elasticity of the adhesive layer.

need to quantitative irrigation potting equipment, please consult my company marketing department.

PACKAGING

Part A: 20kg/plastic pail; Part B: 5kg/plastic pot.

SHELF LIFE AND STORAGE

B components to be protected from light, heat, sealed (can be transported as non-dangerous goods and preservation);

For each part, the shelf life is 1 year (at 25°C)

Chasil 0328 A/B 1:1 low VISCOSITY high Performance & Thermal Conductivity Flame retardant silicone material

1. Flame retardant

2. Two-part, 1:1 mixingratio

3. Medium viscosity Room temperature cure or rapid heat cure

4. Addition cure system: no cureby-products

5. Flame retardant

6. Stable and flexible from -50°C(58°F) to +250°C (432°F)

7. Flexible rubber – protects against mechanical shock and thermal cycling stress at components

8. Excellent dielectricproperties

Color: Gray, Black

Packaging: Part A:25 KG, Part B:25 KG,

Application:

Designed to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration especially where good adhesion is

Typical applications include: encapsulation of amplifiers, automotive electronic units, ballast, bleed resistors, connectors, flyback transformers, high voltage resistor packs, lifting magnets, power controllers, power supplies, radio frequency induction transformers and sensing

Use:

Substrate preparation

All surfaces should be cleaned and degreased with a suitable solvent prior to potting. Care should be taken to ensure that all solvent is removed. For best adhesion, coat surfaces with BGX-706, following the instructions and precautions given for use of these products.

Mixing

CHASIL 0328 is supplied in lot matched kits consisting of Part A and Part B in separate containers. During long periods of storage, someof the filler may settle at the bottom of the containers and should be individually homogenised prior to

Apply

The two components should be thoroughly mixed using a weight ratio of 1:1 until the mixture has a uniform colour. Vacuumde-airing is recommended. A residual pressure of 10-20 mm mercury applied for 5-10 minutes will sufficiently de-air the

Being careful to avoid air entrapment, apply the encapsulant. Vacuum encapsulation is recommended for complex geometries. For information on appropriate dispensing equipment for your application, please contact Beginor marketing department.

Curing

CHASIL 0328   should be cured using one of the following recommended schedules:

8 hours at 23°C, or 60 minutes at 70°C, or 30 minutes at 100°C, or 15 minutes at 150°C. Large components and assemblies may require longer times in order to reach the curing temperature

Chasil 0528 high purity two component liquid silicone material for optical device modules

A high purity two-component heat curing silicone materials. Resistance to environmental pollution, moisture, shock, vibration, etc., Maintain optical properties, mechanical properties and electrical properties in a wide range of temperature, humidity and harsh environmental conditions

1. High transparency

2. Excellent heat resistance

3. Long-term resistancetoUV-A and UV-B

4. No yellowing

5. Fast curing and rapid demold

6. Extremely accurate molding effect

7. Lighter than glass

Color: Clear

Packaging: Part A:10 KG, Part B:10 KG,

Application: Designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.

USE:

The substrate surface should be clean and dry. The substrate can be heated to remove surface moisture. Using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvent to clean surface of the substrate. It should not use the solvent which dissolve or corrode to the substrate, should not use residual solvent.

Please keep accurate weigh to a clean glass container and mix thoroughly. When using high speed mixing equipment, heat will generate and the work time will reduce.

Under 10mmHg vacuum extrusion bubble. Usually prolapse bubbles before dispensing packaging material.

In most cases, the polysiloxane is suitable for working long hours at -45°Cto 200°C, the maximum short-term resistant to 350°C, the specific use, it is best to test the actual requirements.

Before the uncured material, containing not touch N \ P \ S and other organic matter, cannottouch Sn \ Pb \ Hg \ Bi \ As the ionic compound, etc., cannottouch the acetylene-containing \ active vinyl compound, peroxide cannot touch not touch the water gas and alcohols. These substances will hinder curing material reaches a certain concentration, the specific performance of three phenomena: the flow has been in a state completely cured, and the substrate base surface with thin fluid or in Las state, the contact surface and the substrate smiling bubbles. Fully test before use.

Should be cured by heating using a hot air oven ventilation to prevent the accumulation of trace amounts of hydrogen generated in the curing process to produce an explosion hazard.