Chaep 8866 epoxy adhesive cured by heat, designed for general structure adhesive applications
one component epoxy adhesive cured by heat, designed for general structure adhesive applications.
The cured material can provide excellent shear strength, along with impact and heat resistance. It’s designed for protection of bare semiconductor devices.
One component ,solvent free
Easy to handling
Low stress
No Halogen
low VOC, low odor
High shear and impact strength
High temperature resistance
Excellent outing aging
Excellent electrical insulation
Good moisture resistance
Exhibits relatively high flow
Color: Black, White
Packging: 30cc/pcs
Application:
BGA
IC memory cards
Chip carriers
Hybrid circuits
Chip-on-board
Multi-chip modules and Pin grid arrays
Automotive applications
Way of Use:
Surface preparation:keep surfaces clean, dry and grease-free, use a suitable solvent(such as alcohol, acetone) for the degreasing.
Apply the adhesive to cleaned surfaces, assemble parts by sufficient pressure to spread the adhesive to all bonding area. Use a jig/clamp to fix parts till the adhesive is fully cured.
Cure the adhesive according to the schedule listed in the table. Do not move/shock parts during curing.
Before using up, keep the adhesive container tightly sealed.
Items | Value | Method |
Before cured | ||
Appearance | Transpanent fluid | \ |
Viscosity,25℃,mPa.s | 1100±300 | GB/10247-2008 |
Specific gravity,25℃,g/cm3 | 1.10±0.05 | GB/T 13354-92 |
Shelf life | 3 mon@ -5℃ | |
Curing conditions | 30min@150℃ | \ |
Hardness,Shore D | 83±5 | GB/T 531.1-2008 |
Coefficient of Thermal Conductivity, W/(m·K) | 0.27 | GB/T 20673-2006 |
Shear strength, Mpa, steel/steel | >12 | GB 6328-86 |
Glass Transition Temperature (Tg) by TMA, °C | 120 | GB 11998-1989 |
Service temperature(℃) | -40~180 | GBT 20028-2005 |
Chaep 51-8866 black solvent-free single-component epoxy structural adhesive
A black, solvent-free, single-component epoxy structural adhesive with low viscosity, high adhesion strength, low linear expansion coefficient, good toughness and resistance to high and low temperature impact, and can be cured quickly at medium and low temperature. This product’s storage period is 6 months (-5℃t o 0 ℃ freezer)
Color: Black
Packging: 30cc/pcs,100ml, 1L
Application: Miniaturization, Lightweight, High output of power, Electrical and electronic equipment
Way of Use:
If the epoxy adhesive is stored in a frozen environment, it should be removed and defrosted at room temperature before use. During use, the glue should be avoided in a high temperature environment to reduce the consistency of the glue, unless it has been tested in this area and confirmed to be feasible.
Apply the adhesive directly to the surface of the object to be bonded after oil removal, rust removal and coarsening treatment. Select appropriate tools to assist the adhesive coating and fix it with fixtures. Then solidify according to the recommended heating conditions.
ITEM | Test method or condition | Chaep 51-8866 | |
Before curing | Appearance | Visual | Black paste |
Viscosity | mPa·s, 25℃ | 21,000 | |
Density | g/cm3, 25℃ | 1.51 | |
After curing | Hardness | Shore-D, 25℃ | 88 |
Long-term temperature resistance range | ℃ | –50-150 | |
Thermal conductivity | W/m.k, 25℃ | 0.45 | |
Volume resistivity | Ω· cm, DC500V | 5.8×1014 |
Chaep 8166 low temperature cured epoxy adhesive with high adhesion and low water absorption
A low temperature cured one-component epoxy adhesive with high adhesion and low water absorption.
It can be used for bonding of various materials and has good storage stability.
Color: Black
Packing:30ml/pcs
Storage conditionsP:
Store in a clean, dry place at -20°C.
Shelf life:6 month
Application: Mainly used for bonding LED backlight module lens, and bonding camera module CCD / CMOS frame, suitable for bonding temperature-sensitive components.
Way of Use:
Before use, it must be warmed at room temperature for more than 4 hours. Do not open the package until it is restored to room temperature.
It is recommended that the dispensing pressure be 0.15-0.25 MPa. Use needles 21 or 22 with a dispensing speed of 4-10 mm/s.
Applicable for 7 days at 25°C.
The unused glue is first put into a plastic bag and then stored in -20°C.
Item | Test standard | 8116 A | 8116 B |
Properties before cured: | |||
Appearance | white or black paste | white or black paste | |
Base composition | epoxy resin | epoxy resin | |
Viscosity(mPa.s) | (GB/T 2794-1995) | 15000 | 13000-17000 |
(GB/T 13354-1992) | 1.50 | 1.45-1.55 | |
Properties after cured(sample cured at 80 ℃ 60 minutes) | |||
Hardness(shore D) 80 | (GB/T 2411-1980) | 80 | |
Shear strength(MPa) | (GB/T 7124-1986 | (TSS-Fe)15, (TSS-Al ) 10 | |
Elongation at break(%) | (GB 1040-1992) | 2.3 | |
Glass transition temperature(℃) | (ASTM E1545) | 45 | |
Thermal expansion coefficient | (GB/T 1036-1989) | α1 (PPM/℃) 45, α2 (PPM/℃)130 | |
Water absorption(%)(24h@25℃) | (GB/T 1034-1998) | 0.15 | |
Dielectric strength(KV/mm) | (GB 1408.1-1999) | ≥20 | |
Surface resistance(Ω) | (GB/T 1410-2006) | 1×1015 |
Chaep 3666 low-viscosity one component high-performance epoxy resin structural adhesive
A low-viscosity, one-component, high-performance epoxy resin structural adhesive developed for miniaturization, lightweight and high output of power, electrical and electronic equipment.
It is characterized by good storage stability at room temperature, rapid curing under heating, high bonding strength, good toughness, and excellent temperature and weather resistance.
Color: Black
Packging: 1L/barrel
Application: Miniaturization, Lightweight, High output of power, Electrical and electronic equipment
Way of Use:
Products should be stored in a cool and cool place at low temperature
Remove the glue from the freezer before each use to restore the glue to normal temperature. The unused glue must be stored in the freezer
If the viscosity is suitable after the storage period, it can continue to be used
This product is non-dangerous and can be transported under normal conditions
Please consult our Marketing Department if you need glue coating equipment
Item | Test method or condition | Test Results | |
CHAEP 3666 | |||
Before curing | Appearance | Visual | White paste |
Viscosity | mPa·s, 25℃ | 12,000±2,000 | |
density | g/cm3, 25℃ | 1.45±0.05 | |
Shelf life | 0~5℃ | 6 month | |
20~25℃ | 3month | ||
After curing | Hardness | Shore-D, 25℃ | 85 |
Glass transition temperature Tg | DSC, ℃ | 115 | |
Use temperature range | ℃ | –50-155 | |
Shear strength | MPa, Steel-steel,25℃ | >20 |
Chaep 926 solvent-free, one-component epoxy structural adhesive
A gray, solvent-free, one-component epoxy structural adhesive with excellent toughness and impact strength.
When it is fully cured by heat, it provides excellent bonding properties, electrical properties, moisture resistance and mechanical properties. It has high bonding strength to most substrates including glass, metal, ceramics, etc., while meeting high temperatures. Bonding and mechanical properties.
Color: Gray
Packging: 30ml/pcs, 1L/barrel
Application: Widely used in automotive electronics, pressure sensors, connecting harnesses, motor magnetic sheet bonding.
Way of Use:
If the epoxy glue is stored in a frozen environment, it must be taken out to room temperature before being thawed before use.During sizing, do not reduce the consistency of the glue by exposing it to high temperatures, unless prior tests have been done and shown to be feasible.
Apply the adhesive directly to the surface of the object to be bonded after oil removal, rust removal and coarsening treatment. Select appropriate tools to assist the adhesive coating and fix it with fixtures. It is then cured under the recommended heating conditions.
ITEM | Test method or condition | 629 | |
Before curing | Appearance | Visual | Gray slurry |
Viscosity | 93C #Rotor, 5rpm,Pa·s, 25℃ | 112 | |
Viscosity | 93C #Rotor, 0.5rpm,Pa·s, 25℃ | 278 | |
Thixotropic index | – | 2.5 | |
Density | g/cm3, 25℃ | 1.25-1.35 | |
After curing | Hardness | Shore-D, 25℃ | 85 |
Glass transition temperature Tg | DSC, ℃ | 145 | |
Impact strength | KJ/m2,25℃ | >6 | |
Linear expansion coefficient | ppm | 45,<Tg 100, >Tg | |
Volume resistivity | Ω· cm, DC500V | 1.0×1015 |